Elpida Memory and Spansion have jointly developed 1.8V, 4Gb single-level cell (SLC) NAND flash chips, according to Elpida.

This NAND memory, based on Spansion's MirrorBit charge-trapping technology, is being produced at Elpida's Hiroshima factory.

Elpida said it expects to start shipping samples of the 4Gb NAND products in the fourth quarter of 2010, with mass production slated for the first quarter of 2011.

Spansion will ship samples in the first quarter of 2011, and begin production in the second quarter of 2011, Elpida added.

Both companies are also developing 3.0V products, and plan to offer their jointly-developed NAND products in densities ranging from 4Gb to down to 1Gb.

"The teams have made significant progress in this development and we believe it will benefit both Elpida's and Spansion's customers with new NAND products targeted at the specific market segments we each serve," said John Kispert, president and CEO of Spansion.

Elpida plans to combine NAND flash memory with mobile RAM for mobile consumer products, whereas Spansion is developing NAND solutions for the embedded and select wireless markets.

Elpida in July announced its alliance with Spansion, in which Elpida gets access to Spansion's NAND IP portfolio while giving the flash maker a cost-effective manufacturing solution with reduced R&D expenditures. Under the terms of the agreement, each company will separately market products to their customers.

By: DocMemory
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