Globalfoundries has announced the addition of a new technology offering based on its 28nm high-k metal gate (HKMG) technology, and revealed for the first time its manufacturing timeline for the 22/20nm node.

In the face of the growing market for smart mobile devices requiring more than 2GHz of processing power, Globalfoundries is adding a high performance-plus process to its 28nm HKMG family. Dubbed 28nm HPP, the technology provides a performance boost of as much as 10% over the foundry's current 28nm HP offering. Globalfoundries said it is scheduled to kick off risk production for the 28nm HPP node in the fourth quarter of 2011.

The 28nm HPP rounds out Globalfoundries' 28nm offerings, which include a high-performance (28nm HP) process targeted at wired applications and a low-power (28nm SLP) node for power-sensitive mobile and consumer applications. All 28nm technologies feature the foundry's gate-first approach to HKMG, according to the company.

Globalfoundries is also on track to deliver 22/20nm technology to customers for product introduction in 2013, following risk production set to begin in the second half of 2012. The 20nm technology offerings will come in two varieties: a high-performance (20nm HP) technology designed for wired applications such as servers and media processors, and a low-power version (20nm SLP) designed for power-sensitive mobile applications.

A 22nm SHP (super high performance) technology will also be launched, being designed for devices requiring the utmost in performance, Globalfoundries indicated. The 22/20nm technologies are planned to be a full node shrink from 32/28nm, and will utilize next-generation HKMG technology, the foundry said.

By: DocMemoryu
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