Packaging and testing house ChipMOS Technologies has unveil plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by the end of 2010.

ChipMOS also plans to ramp up 12-inch gold bumping capacity to 10,000 wafers a month by the end of the third-quarter 2011, according to the company.

In addition, ChipMOS said it will migrate its existing 8-inch RDL (re-distribution layer) capability to 12-inch together with this
capacity expansion, to provide more MCP flexibility for mobile/niche DRAM or flash customers.

"The decision to expand our high-performance, gold bumping capacity was driven by increasing demand for product applications, such as those used by smartphones," said SJ Cheng, chairman and CEO of ChipMOS. "As an added bonus, we will also be able to utilize the 12-inch wafer gold bumping line for 8-inch wafer gold bumping production in order to address anticipated 8-inch capacity shortage."

"Since this line expansion was already factored into our capex plans as discussed in the most recent investors conference call, it will not result in any increase to our budget," Cheng added.

By: DocMemory
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