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ProMos reveal plans to build 25,000 wafers by the end of 2010.


Thursday, October 7, 2010

ProMOS Technology has revealed that plans to scale up its monthly output using 63nm process technology to 35,000 wafer starts will not be carried out until 2011, due to delivery delays of new equipment.

ProMos said it expects the level to reach 20,000-25,000 units by the end of 2010.

ProMOS added it will be capable of processing 10,000 wafers per month on the 63nm node in October.

ProMOS was expected to convert more than half of its capacity to the 63nm node, from 72nm, which is still the company's major production process, by the end of 2010. It currently runs a 12-inch fab with monthly capacity estimated at 60,000 wafers.

Due to eroding DRAM spot prices, ProMOS's revenues slid 7.6% sequentially to NT$2.23 billion in September. But cumulative consolidated revenues from January through September reached NT$17.63 billion, jumping from NT$6.7 billion during the same period of 2009.

By: DocMemory
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