Xilinx has announced its 28nm 7 series FPGAs, which embrace 3D packaging technologies and through-silicon vias (TSV) for applications requiring high-transistor and logic density as well as tremendous levels of computational and bandwidth performance.

Xilinx said the device will be built by its patented FPGA architectural innovations, and advanced technology from Taiwan Semiconductor Manufacturing Company (TSMC).

Within the Xilinx stacked silicon interconnect structure, data flows between a set of adjacent FPGA die across more than 10,000 routing connections. Compared with having to use standard I/O connections to integrate two FPGAs together on a circuit board, stacked silicon interconnect technology provides over 100X the die-to-die connectivity bandwidth per watt, at one-fifth the latency, without consuming any high-speed serial or parallel I/O resources.

Xilinx also noted that its choice of 28nm HPL (high-performance, low-power) process technology for the base FPGA device provides a comfortable power budget in the package for integrating FPGA die.

The new Xilinx 28nm FPGAs will be available in the second half of 2011, according to the company.

In February, Xilinx announced it had chosen the HKMG high-performance, low-power process at TSMC for next-generation FPGAs.

By: DocMemory
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