Thursday, January 13, 2011
IBM and Samsung have jointly announced they will collaborate on basic research into new semiconductor materials, manufacturing processes and other technologies. The agreement calls for the two companies to jointly develop new semiconductor process technology that can be used in a broad range of applications – from smartphone to communications infrastructure.
Samsung researchers will join scientists at the IBM Semiconductor Research Alliance at the Albany Nanotech Complex, New York. The research developments from this joint activity are planned to enable the delivery of industry leading silicon solutions that are optimized for performance, power consumption and size.
New process technology developed by the companies is planned to extend leadership in mobile computing as well as other high performance applications. For consumers, a new generation of devices – smarter, connected and more mobile – will require essential semiconductor breakthroughs to keep pace with technology trends, the companies said.
"Collaborative innovation will be critical if the semiconductor industry is to continue driving new forms of consumer electronics and new methods of computing," said Michael Cadigan, general manager, IBM Microelectronics.
The agreement also renews IBM and Samsung's joint process development agreement (JDA) to multiple nodes starting at 20nm. IBM and Samsung plan to develop advanced technologies for foundry customers, enabling high-performance, energy-efficient chips at 20nm and beyond.
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