Taiwan Semiconductor Manufacturing Company (TSMC) will soon break ground for the second phase construction of its 8-inch wafer plant in Songjiang, Shanghai (China).

TSMC is currently evaluating the feasibility of buying used production equipment, as it attempts to accelerate expansion in order to meet rising demand from international IDMs, the report said. The company is also shifting 8-inch manufacturing equipment from its fabs in Taiwan to the China plant, the report added, without citing its sources.

TSMC previously revealed that the company would ramp up capacity at its Songjiang 8-inch fab to 50,000 wafers a month at the end of 2010, and plans to boost the monthly level to 110,000 units. TSMC did not disclose a time-frame for the latter goal.

TSMC now runs the China fab at 0.13-micron and above processes.Combined with the first phase, the Songjiang facility will have a total capacity of 110,000 wafers a month.

By: DocMemory
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