United Microelectronics Corporation (UMC) has acquired NT$561 million (US$19 million) worth of production equipment from subsidiary Hong Bao Technology (transliterated from Chinese), which designs and develops through silicon via (TSV) and other 3D IC technologies for image sensor components and memory chips.

UMC previously revealed that it plans to absorb the 73%-owned subsidiary, which will liquidate, due to cost and other concerns, according a TSE filing issued in February.

In mid-2010, UMC announced that it has forged a three-way tie for the development of 3D IC integration solutions with chip supplier Elpida Memory and Powertech Technology (PTI), which provides assembly and testing services.

UMC CEO Shih-Wei Sun was quoted in previous reports saying the company expects to start sampling integrated 3D IC solutions using 28nm process technology in mid-2011, with volume production slated for 2012.

By: DocMemory
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