Elpida Memory has revealed plans to start mass producing 2Gb DDR3 SDRAM for PC applications in May 2011, using 30nm-class process technology. Manufacturing will take place at its Hiroshima, Japan plant as well as Taiwan-based Rexchip Electronics.

Elpida's Hiroshima plant will devote 20% of its production capacity to manufacturing the new 30nm chips in the second quarter of 2011, the company said. The ratio will rise to 30% in the third quarter as a result of Elpida's process transition to more cost-effective node technologies, the company added.

Rexchip will start producing chips using Elpida's 30nm process in the third quarter of 2011, Elpida indicated. The manufacturing subsidiary is expected to allocate half of its capacity to 30nm products in the third quarter, and gradually convert all of its wafer starts to the more advanced process in the last quarter of the year.

Elpida said it will also adopt the advanced process for 4Gb DDR3 DRAM and 4Gb DDR3 mobile RAM products, with mass production slated for later in 2011.

"Elpida's 30nm process DRAM yields 45% more chips per wafer than 40nm products and consumes at least 20% less power," the company said in a statement. "30nm process DRAM helps slash the size and power consumption of a wide range of digital electronics devices, from lightweight battery-powered mobile devices such as smartphones and tablets, to computers and servers demanding lower power consumption."

By: DocMemory
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