Winbond Electronics' sales generated from its NOR flash business grew 8% sequentially in the first quarter of 2011, while those from other segments saw on-quarter drops, according to the company.

Winbond said its 1.8V serial flash products have been qualified by several handset chipset clients. The company also revealed it will start manufacturing NOR chips using 58nm process technology in the second half of 2011, which will help lower production costs.

First-quarter sales of NOR flash enjoyed a 50% rise compared to the same period of 2010, Winbond indicated.

Winbond saw sales generated from its mobile RAM business increase 66% on year in the first quarter of 2011. Sales on a sequential basis, however, declined 11% due to customers adjusting their inventory and falling product ASP, the company said.

Winbond noted that it is migrating to a 65nm process for pseudo SRAM production, and will start volume shipping low-power DRAM to MCP (multi-chip package) manufacturers later in the second quarter.

As to specialty DRAM, Winbond expects ASP to rebound in the second quarter and is eyeing the growth potential of SDRAM products for know-good-die (KGD), automotive and industrial applications. About 70% of Winbond's SDRAM shipments were made using 65nm process technology in March, the company added.

Winbond revealed that its sales ratio between SDRAM, NOR flash, mobile RAM and others was 36:31:28:4 in the first quarter, compared to 38:21:18:23 a year ago.

Winbond posted NT$7.16 billion (US$250 million) in first-quarter revenues, down 7% on quarter but up 2% from the same period of 2010. Net profits for the first quarter of 2011 were NT$118 million, which translated into an EPS of NT$0.03.

By: DocMemory
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