Taiwan Semiconductor Manufacturing Company (TSMC) has begun equipment move-in for the phase 1 facility of a new 12-inch fab (Fab 15) with volume production of 28nm technology products slated for the fourth quarter of 2011, according to the foundry.

TSMC previously said it would begin moving equipment into the facility in June, and expected volume production to kick off in the first quarter of 2012.

Pilot runs at the phase 1 facility of Fab 15 are expected to start in the third quarter of 2011, following by volume production in the fourth quarter, said Jason Chen, senior VP of worldwide sales and marketing for TSMC, at a company event held on May 5. With new capacity coming online, TSMC will see its combined 12-inch capacity top 300,000 units a month.

TSMC's managed capacity exceeded 10 million 8-inch equivalent wafers for the first time in 2010. By 2015, TSMC's total installed capacity is expected to double, according to YP Chin, VP of operations and product development for the company.

TSMC has also actively diversified into the backend packaging and testing field, said Chin, adding that more than 250 employees are being hired to enhance its R&D strength in the sector. TSMC has been in-house developing lead-free bumping technology, and is looking to expand capacity for the segment substantially in the next couple of years.

By: DocMemory
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