Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports it has cut prices for 12-inch gold bumping by 4-5% in order to secure orders.

Chipbond had been the only chip packager with gold bumping capability for 12-inch wafers, until ChipMOS Technologies stepped into production of 12-inch gold bumping. ChipMOS was quoted as saying in previous reports that it plans to grow 12-inch gold bumping capacity to 8,000 wafers a month by the end of 2011, and expects sales of its 12-inch wafer gold bumping services to start contributing to company revenues in the fourth quarter.

Chipbond's monthly capacity for 12-inch gold bumping is estimated at 15,000 wafers, with clients including Japan-based Renesas Electronics, Taiwan-based Novatek Microelectronics, ILi Technology (Ilitek) and Orise Technology.

By: DocMemory
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