Micron Technology and Samsung Electronics have announced a collaboration among leading industry OEMs and enablers to form the Hybrid Memory Cube Consortium, the goal of which is to develop an open interface specification for the Hybrid Memory Cube.

Altera Corporation, Open-Silicon, Inc., and Xilinx, Inc. are joining Samsung and Micron in developing the HMC interface specification, thereby facilitating the integration of HMC into a wide variety of applications to assist developers, manufacturers, and enablers in leveraging this breakthrough technology. Additionally, the Consortium is open to an unlimited number of adopters who can participate in discussions about the specification and gain early access to drafts of the specification

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved