Monday, October 24, 2011
The book to bill ratio for North America-based semiconductor equipment manufacturers—the three-month average ratio of bookings to billings—declined to 0.75 in September, its lowest level since May 2009, according to the trade group SEMI.
Japanese semiconductor equipment firms also recorded a global three-month-average book-to-bill ratio of 0.75 in September, according to the Semiconductor Equipment Association of Japan (SEAJ).
The three-month average of orders booked by North American fab tool makers declined to $984.8 in September, 15.3 percent less than in August and 40 percent below the level of September 2010, SEMI (San Jose, Calif.) said. North American chip tool firms had a three-month average of worldwide billings in September of $1.31 billion, down 9.8 percent from August and down 18.4 percent from September 2010, SEMI said.
A book-to-bill of 0.75 means that $75 worth of orders were received for every $100 of product billed for the month.
"Both billings and booking continue to decline with three-month average bookings almost reaching a value last reported in late 2009," said Stanley T. Myers, president and CEO of SEMI, in a statement. "While device makers are investing in advanced technology, broader investments await stability in the overall economic outlook."
Japan-based fab tool makers booked 79.5 billion yen (about $1 billion) worth of orders in September, down 4.5 percent from August and down 37.9 percent from September 2010, according to SEAJ.
The three-month average of worldwide billings for Japanese tool vendors in September was 106.45 billion yen (about $1.4 billion), down 3.2 percent from August and down 5 percent from September 2010, SEAJ said.
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