Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies.

The method is to replace gold bumping as the latter carries higher material costs.

Prices for gold bumping services have risen to reflect the rising prices for gold. However, backend service providers sometimes need to digest their own costs during bad times, when their clients have more bargaining power. As a result, looking for alternatives to gold bumping could be the way to reduce costs.

According to Chipbond, shipments of its Cu/Ni/Au bumping totaled 4,500 wafers in November, up from 3,000 units in October. The output climbed to 5,000 units at the end of 2011, said Chipbond, adding that its monthly capacity for Cu/Ni/Au bumping can reach 225,000 wafers.

Chipbond noted that its existing equipment and facilities are able to smooth the transition from gold bumping to the new method, without extra expenditure on new tools.

Chipbond expects half of its driver IC output will adopt Cu/Ni/Au bumping over the next two years. Currently about seven clients place orders for the new process, Chipbond added.

Sitronix, Himax, Orise and Ilitek reportedly are among Chipbond's clients requesting Cu/Ni/Au bumping services, according to industry sources.

ChipMOS revealed that its capacity for Cu/Ni/Au bumping has grown to 9,000-10,000 wafers a month, with monthly demand estimated at 3,000-5,000 units.

ChipMOS reportedly provides Cu/Ni/Au bumping services to customers including Novatek and Ilitek

By: DocMemory
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