Chipbond Technology is expected to post a sales drop of about 5% sequentially in the fourth quarter of 2012, compared to the double-digit declines usually seen in previous fourth quarters, according to market watchers.

Brisk demand coming from the smartphone and tablet sectors will allow Chipbond to enjoy a particularly strong fourth quarter, the watchers indicated. The company has seen strong demand for its 12-inch gold bumping services and COG (chip-on-glass) packaging, the watchers said.

Chipbond reportedly has cut into the supply chain for Apple's iPhone 5 and new iPod touch, through providing backend services for LCD driver ICs used in the devices to Renesas Electronics. Renesas has demanded more gold-bumping capacity for 12-inch wafers at Chipbond, with orders placed for the fourth quarter rising about 33% sequentially.

Chipbond has announced that consolidated revenues for the third quarter climbed to a record NT$3.88 billion (US$132.7 million), which showed a 6.9% sequential increase.

By: DocMemory
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