Taiwan Semiconductor Manufacturing Company (TSMC) has bought a land lot of 14.32 hectares in the Chunan base of Hsinchu Science Park (HSP) for NT$3.2 billion (US$109.1 million), and will use the land to build a pilot line for the development of 18-inch (450mm) wafers as well as 7nm manufacturing process,

Construction of the pilot plant will begin in 2016 with installation of equipment and trial production slated for 2017.

If the trial production goes smoothly, TSMC is expected to enter volume production of 18-inch wafers at its Fab 15 located in the Central Taiwan Science Park (CTSP) by the end of 2017.

By: DocMemory
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