Winbond Electronics has announced that it is ramping up production of serial NOR flash chips using 58nm process technology.

At its 12-inch wafer fab in Taichung, central Taiwan, Winbond is increasing production of its 58nm SpiFlash memories, the company said. Winbond now offers a broad line of 58nm SpiFlash memories spanning 32Mb to 256Mb densities, 3V and 1.8V power supplies, in a range of packages and known-good-die (KGD) solutions.

The newer 58nm process node provides a more cost-effective, feature-rich and higher-performance solution than the 90nm technology now used primarily for lower-density SpiFlash products ranging from 512Kb to 16Mb, Winbond revealed.

Winbond expects sales of its 58nm serial flash chips to account for nearly half of company revenues in 2013, with demand for applications such as handsets, tablets and digital TVs driving the growth.

Winbond also disclosed that the company has shipped more than five billion serial flash memories since its SpiFlash product line was launched in 2006. The firm expects sales of its 58nm chips to grow to nearly half of its total revenues in 2013.

In addition, Winbond claimed that the company is now the world's top supplier of serial NOR flash memories. Citing recent market data from WebFeet Research, Winbond said it took the number-one position in 2012 with 27.5% market share of the US$1.34 billion serial flash market. Winbond added it shipped 1.7 billion flash memories in 2012, which is 33% of all serial flash units worldwide.

By: DocMemory
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