Powertech Technology (PTI) expects its second-quarter 2013 consolidated revenues to significantly increase on quarter mainly due to continued growth in demand from the mobile DRAM, NAND flash and logic IC segments, company chairman Tsai du-kung has said.

Orders from the NAND flash segment has been increasig due to growing demand for the memory from the smartphone and tablet markets, Tsai indicated. As NAND flash testing capacity has been fully utilized, PTI will use DRAM testing equipment to test NAND flash, with utilization of DRAM testing capacity expected to rise from 50% currently to nearly 70% in second-half 2013, Tsai said while speaking at an investors conferrence on April 30.

Kingston Technology in late April acquired a monthly DRAM foundry capacity equivalent to 20,000 12-inch wafers from Powerchip Technology and will commission the latter to undertake OEM production, with Kingston expected to have PTI provide packaging and testing services beginning from the second quarter, Tsai indicated.

For logic IC packaging, PTI has employed advanced technologies including FBGA (fine-pitch ball grid array), CPB (copper pillar bump) and flip chip, and has been developing technologies including RDL (redistribution layer), CPB, TSI (through-silicon interposer), TSV (through-silicon via) CIS CSP/COW, 2.5D/3D IC, Tsai said.

Of PTI's first-quarter consolidated revenues of NT$9.208 billion (US$308 million), the DRAM segment accounted for 42%, NAND flash for 34% and logic IC for 24%.

PTI will distribute a cash dividend per share of NT$3 for 2012, with NT$1 to come from 2012 net profit and NT$2 from cumulative legally reserved earnings and earnings reserved for additional capital.

By: DocMemory
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