Taiwan Semiconductor Manufacturing Company (TSMC) plans to build its first 450mm (18-inch) pilot production lines, which will offer FinFET transistor technology at 10nm and 7nm nodes, in 2016-17.

TSMC also hopes to adopt extreme ultraviolet (EUV) lithography to make 10nm chips, with equipment move-in slated for the end of 2017.

JK Wang, VP of operations for 300mm fabs for TSMC, indicated that equipment suppliers were previously hesitant about pouring cash into fab tools for 18-inch wafer manufacturing. However, the industry is now aware of the upcoming transition to 18-inch wafers, Wang said.

Every major equipment maker has allocated about 15% of their R&D capex to develop manufacturing equipment for 18-inch wafer production, Wang observed.

TSMC is looking to finish installing most of its required equipment for 18-inch wafer manufacturing by the end of fourth-quarter 2015, and expects to construct its first 18-inch pilot lines between 2016 and 2017, Wang disclosed. In addition, installation of EUV equipment as well as 193nm wavelength immersion scanners is set to complete by the end of 2017, Wang said.

TSMC's 18-inch facilities will enter 10nm and 7nm process generations , Wang noted.

In addition, Wang revealed that TSMC will expand its 28nm foundry capacity to a monthly level of 100,000 12-inch wafers at the end of 2013. The foundry is also gearing up for 20nm chip production in 2014, Wang added.

By: DocMemory
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