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UMC & IBM co-develop 10nm process development


Friday, June 14, 2013

United Microelectronics (UMC) has announced that the company will join the IBM joint technology development alliance to participate in the group's development of 10nm CMOS process technology.

"Established over a decade ago, the IBM alliance allows partners to leverage our combined expertise and collaborative research and innovative technology development to address the demanding needs for advanced semiconductor applications," said Gary Patton, VP Semiconductor R&D for IBM, said in a statement issued by UMC.

Globalfoundries and Samsung Electronics are among the IBM-led joint development alliance members.

UMC said that it will send an engineering team to join the 10nm development work, which will take place in Albany, New York, while UMC's 14nm FinFET and 10nm implementation will take place at UMC's Tainan, Taiwan R&D site.

UMC around mid-2012 announced that the company had licensed 20nm CMOS and FinFET technologies from IBM. UMC was still not part of the IBM-led process technology alliance at that time. UMC is planning to implement FinFETs at the 14nm node.

By: DocMemory
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