In an effort to plot further miniaturization of system-in-package solutions, Infineon Technologies, together with 40 research partners in Europe, announced Wednesday (Aug. 21) that it has successfully completed a large-scale research project called ESiP (Efficient Silicon Multi-Chip System-in-Package integration).

The advantages of System-in-Package (SiP) are well known, since SiP allows chip designers to integrate, in one package, different types of chips made by using different production techniques and structure widths.

The goal for the ESiP project, however, was set to develop much more compact and reliable SiP solutions than those available today. The research partners, who described it as an entirely new class of SiP, hope to use the miniaturized SiPs for such applications as electric vehicles, industrial, medical equipment and communications technology.

The ESiP research group claims they have developed basic technologies that enable the integration of various types of chips in the smallest volume SiP packages."For example, customer-specific processors with the latest CMOS technologies, light-emitting diodes and DC-DC converters, MEMS and sensor components and passive components such as miniaturized capacitors and inductors," they explained.

It's important to note that the research group investigated not only new production processes for compact SiP solutions, but also new materials for building SiPs. Their efforts led to a number of innovations ranging from the development of materials to manufacturing process and testing methodologies.

While probing the feasibility and reliability of the new production processes, the group discovered that "test procedures commonly used today are no longer sufficient for future SiP solutions." The research group also developed new test flows, probe stations, and probe adapters for 3D SiP.

Working on what was billed as the largest research project in Europe for SiP, the group faced high expectations in efforts to improve the future of the European microelectronics industry. The group, under Infineon management, had 40 participating microelectronics and research entities from nine European countries. Funds came from public authorities in all nine countries and the ENIAC Joint Undertaking -- a public-private partnership focusing on the development of nanoelectronics in Europe. Among nine nations, Germany -- where Infineon is based -- was the largest contributor.

By: DocMemory
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