TSMC has announced that executive VP and co-chief operating officer overseeing R&D, Shang-yi Chiang, will retire from the company on October 31, 2013.

Chiang will continue to serve as advisor to the chairman of TSMC, sit on the company's board of directors meetings, and take on other special assignments.

Chiang joined TSMC in 1997 and led the foundry's R&D team through five generations of technology, from 0.25-micron to 65nm. Chiang first retired in 2006, but was invited by Chang to return in 2009, and has since led R&D through the 28nm and 20nm processes and into the 16nm FinFET generation. Under Chiang's leadership, TSMC has also initiated R&D activities into 10nm and considerably strengthened its capabilities in pathfinding and advanced packaging.

Chiang indicated that during his terms at TSMC, the R&D team has expanded to 7,600 people from less than 400. "It has been my honor to fulfill the missions that chairman Chang entrusted to me in 2009, and I can now leave him with a world-class R&D team eager to challenge the limits of semiconductor technology," said Chiang.

In March 2012, TSMC announced the appointment of three co-COOs. The appointment is part of the company's CEO succession plan, chairman Morris Chang noted. Chang added that in principle, he would relinquish the CEO role by mid-2014.

TSMC's head of operations Mark Liu and business development chief CC Wei are the two other COOs.

By: Docmemory
Copyright © 2023 CST, Inc. All Rights Reserved