Thursday, November 21, 2013
SK Hynix has started full-scale mass production of 16nm 64-gigabit (Gb) MLC NAND flash chips, according to the South Korea-based memory chipmaker. SK Hynix entered mass production of its first-version 16nm NAND flash in June, and has recently started to mass produce the second version which is more cost competitive due to its smaller chip size, the company said.
SK Hynix has also developed 128Gb (16-gigabytes, 16GB) MLC chips based on the specification and endurance of 16nm 64Gb MLC, with mass production scheduled for early 2014, the company noted.
Generally, the thinner process technology shrinks the more frequent interferences among cells occur, but SK Hynix applied up-to-date Air-Gap technology to overcome the interferences among the cells, the company indicated. The Air-Gap technology builds insulation shield with vacuum holes between circuits not with insulating substances.
"After the company developed and started to mass produce the industry's thinnest 16nm product then now prepared high density NAND flash product portfolio thanks to the development of 16nm 128Gb MLC," said Jin Woong Kim, senior VP and head of SK Hynix' flash tech development.
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