Tuesday, February 4, 2014
Semiconductor Manufacturing International's has successfully entered the multi project wafer (MPW) stage to support customer requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate (HKMG) processes.
Over 100 IPs from multiple third-party IP partners, as well as SMIC's internal IP team, are prepared to serve various projects from worldwide design houses.
SMIC's 28nm process technology targets primarily mobile computing- and consumer electronics-related applications, such as smartphone, tablets, TVs, set-top boxes and networking. It provides customers high performance application processors, cellular baseband, wireless connectivity, etc.
"The first SMIC 28nm MPW shuttle included both 28PS and 28HKMG related customer products for verification, and was launched at the end of 2013 as planned," said Shiuh-Wuu Lee, executive VP of technology development at SMIC. "By taking more MPW shuttles in 2014, we will continue to take more positive steps to strengthen and diversify our technology offerings and meet customers' growing demands on both advanced and differentiated technologies."
Citing an IHS forecast, SMIC noted that the pure-play foundry revenue potential for 28nm will rise with a CAGR of 19.4% from 2012 to 2017.
By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved
|
