Thursday, March 20, 2014
Micron Technology reportedly plans to release more backend packaging orders for its commodity DRAM chips to Taiwan-based IC testing and packaging companies starting the first half of the second quarter of 2014, according to industry sources.
Micron is currently rolling out standard DRAM chips from its plant in Malaysia but plans to switch the plant's production from DRAM chips to NAND flash products, and therefore it needs to outsource packaging capacity to Taiwan, the sources noted.
For the outsourcing plan, Micro is undertaking validation at a number of backend service firms in Taiwan, with the process slated for completion at the end of the first quarter, said the sources.
Advanced Semiconductor Engineering (ASE) reportedly will team up with Micron to set up a joint packaging and testing fab in Xian, China, and therefore it is situated to land windfall orders from Micron, the sources commented.
However, other backend services companies including Powertech Technology (PTI), ChipMOS Technologies and Walton Advanced Engineering also have chances to win new orders from Micron since they are also providing the US-based memory chipmaker with backend services mainly for standard DRAM, mobile DRAM and NAND flash memory chips, added the sources.
By: DocMemory
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