Macronix International and Winbond Electronics both will step up efforts to ramp up production of low-density NAND flash chips despite the recent move by Toshiba to file complains against four Taiwan-based companies, according to industry sources.

Toshiba announced in early June that it had filed a suit with the Intellectual Property Court in Taiwan against Powerchip Technology, Powerflash Technology, Zentel Electronics and CTC Company for infringement of Toshiba's Taiwan patents on the production of NAND flash memory products.

Macronix said it has begun producing its in-house developed single-level cell (SLC) NAND flash chips at 12-inch fabs using a 36nm process. Macronix' NAND flash parts will range from 1Gb-8Gb, with the 8Gb models to be available in the second half of 2014.

Additionally, Macronix also plans to start volume production of NAND-based MCP solutions in the second half of the year.

Winbond said that it will focus on 1Gb-2Gb SLC NAND flash chips and will push sales of its NAND flash parts into the supply chains of brand vendors.

By: DocMemory
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