Qualcomm reportedly has placed its first batch of FinFET chip orders with Samsung Electronics, instead of Taiwan Semiconductor Manufacturing Company (TSMC) as widely expected. Samsung will utilize the FinFET technology using a 14nm process compared to a 16nm node by TSMC, according to industry sources.

Although the die size of 16nm chips is larger than that of 14nm parts, TSMC has been confident that it can ramp up output optimizing its high yield rates on chip production, and therefore helping clients to reduce production costs, said the sources.

While it has been Qualcomm's policy to corporate with multiple foundry houses on 28nm or more mature processes, including TSMC, Samsung, Globalfoundries, United Microelectronics Corporation (UMC) and Semiconductor Manufacturing International Corporation (SMIC), Qualcomm runs the risk of not tying up with TSMC on the development of FinFET products, commented the sources.

For example, FPGA chip vendor Altera had previously chosen Intel to develop its 14nm FinFET products, but was forced to switch to TSMC due to lower yield rates at Intel, the sources indicated.

MediaTek, a major contender of Qualcomm, has been cooperating with TSMC in 28nm and 20nm processes and will continue to develop chips utilizing TSMC's 16nm FinFET Plus process, said the sources.

By: DocMemory
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