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TSMC to expand backend through acquisitions


Tuesday, November 11, 2014

Taiwan Semiconductor Manufacturing Company (TSMC) is mulling buying a Qualcomm factory in Taiwan as part of plans to expand its packaging and test business, according to a Chinese-language Economic Daily News (EDN) report.

Located in Longtan, northern Taiwan, the Qualcomm factory will be acquired by TSMC for several billion NT dollars, the report said, without citing its sources.

For its backend unit, TSMC focuses on the high-end segment. The foundry has offered a cost-efficient integrated fan-out wafer level packaging (InFO-WLP) process and CoWoS (chip-on- wafer-on-substrate) packaging for 3D ICs.

By: DocMemory
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