ChipMOS Technologies Ltd, a provider of outsourced semiconductor assembly and test services (OSAT), has signed a Letter of Intent to collaborate with Tokyo Seimitsu Co. Ltd (ACCRETECH) to develop new equipment and process automation at ChipMOS' Tainan fab.

Under the agreement, ACCRETECH will be responsible for the equipment design and manufacturing. This is expected to include, but will not be limited to, probers for wafer testing and wafer dicing equipment. ChipMOS will provide engineering resources for development, testing and evaluation of the jointly-developed new equipment and production lines.

S.J. Cheng, chair and CEO of ChipMOS, said, "Today's strategic agreement further builds upon our existing relationship, which started more than 15 years ago. By working in partnership together we believe we can ultimately decrease production costs, enhance production efficiency and increase our already strong respective competitive positions."

By: DocMemory
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