Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for a new fab at its 12-inch wafer plant in central Taiwan in June 2015. The fab is designed to manufacture chips using 10nm process technology, according to TSMC chairman Morris Chang.

Volume production at the new facility of Fab 15 will kick off in mid-2016, said Chang.

Chang further noted that TSMC never competes directly with its fabless clients, and treats them as partners. Being a dedicated foundry is TSMC's fundamental value and competitive advantage over rivals, Chang said.

TSMC disclosed previously that the company is scheduled to move its 10nm process technology to volume production by the end of 2016. The node technology will target production for mobile application processors, baseband chips, server chips, graphics processors (GPU), network processors and chips for gaming systems.

By: DocMemory
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