TSMC has reiterated plans to move 10nm FinFET technology to risk production at the end of 2016, followed by mass production in the first quarter of 2017.

Commercial production of chips made on the new process will take place in TSMC's manufacturing site at the Central Taiwan Science Park (CTSP) in Taichung, the foundry disclosed.

Intel recently confirmed that its 10nm process will not be ready for volume production until the second half of 2017. TSMC might beat Intel in the 10nm race.

In addition, TSMC entered volume production of chips made using its 16nm FinFET process in July 2015, and is on track to move the node to mass production starting the fourth quarter, the company disclosed.

TSMC is confident it will grab the largest share of the 14/16nm FinFET market segment in 2016, company chairman Morris Chang said.

As for TSMC's 20nm process, revenues for 2015 are set to double from 2014 levels, the company indicated. TSMC also noted its 28nm technology remains competitive and is identified as the main revenue contributor in 2015 and 2016, the company said.

TSMC is targeting a more than 10% CAGR for both revenues and profits in 2015-19, with a more than 20% ROE (return on equity), according to the pure-play foundry.

By: DocMemory
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