United Microelectronics (UMC) has entered volume production for AMD's graphics chips using through-silicon-via (TSV) technology, according to the Taiwan-based pure-play foundry.

UMC's production for AMD's Radeon R9 Fury X series GPUs has taken place at the foundry's specialty 300mm Fab 12i in Singapore.

The AMD Radeon R9 Fury X GPU utilizes UMC's TSV process technology and die-stacking to fuse HBM DRAM with AMD's GPU on a silicon interposer, enabling the GPU to deliver unmatched memory bandwidth of 4096-bit and quadruple the performance-per-watt over the current GDDR5 industry standard, UMC noted.

By: DocMemory
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