The 20th annual SEMICON Taiwan tradeshow will kick off on September 2 and run through September 4 at the TWTC Nangang Exhibition Hall. The show will host more than 700 exhibiting companies with more than 1,400 booths.

Foundry and DRAM are the two major sectors in terms of equipment investment in Taiwan, with OSATs' advance packaging facilities as a key growth driver, according to SEMI. Fab equipment spending in Taiwan is projected at about US$10.5 billion in 2015, approaching 30% of the overall industry spending on fab equipment. Overall, Taiwan represents 21% of the installed fab capacity globally and 25% of the installed 300mm capacity.

In 2015 alone, companies in Taiwan are forecast to spend in excess of US$1.5 billion on packaging and test equipment, SEMI noted. With the growing importance of packaging and testing, SEMI will host a 2-day summit to bring together over 20 CTOs and industry leaders sharing their insights and perspectives on 3D-IC, through-silicon via (TSV), 2.5D-IC with silicon interposer, and embedded substrate technologies.

Executives and professionals from leading semiconductor companies including TSMC, ASE, Broadcom and Applied Materials are invited to give speeches at technology and business forums during the tradeshow. Technology forums will cover topics such as SiP, and advanced technologies for Internet of Things (IoT).

According to Taiwan's Industrial Economics and Knowledge Center (IEK), the IoT market will rise from US$14.6 billion in 2015 to US$26.1 billion by 2019. Emerging IoT applications could have a significant impact on the overall semiconductor industry.

By: DocMemory
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