Taiwan Semiconductor Manufacturing Company (TSMC) will be the exclusive supplier of Apple's next-generation A10 processors with volume production to kick off starting March 2016, according to a recent Chinese-language Commercial Times report.

TSMC will offer its in-house developed backend integrated fan-out (InFO) wafer-level packaging for the production of the A10 chips, which will be built using the foundry's 16nm FinFET process technology, said the report, which cited unspecified Apple suppliers as its source. The A10 will be featured in the iPhone 7 series slated for launch during the third and fourth quarters of 2016.

In addition, TSMC with its 16nm process has obtained half of Apple's total A9 chip orders, the report quoted the sources as indicating. The just-announced iPhone 6s and 6s Plus are all powered by the application processor.

TSMC said it does not comment on speculation about customers and orders.

By: DocMemory
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