A groundbreaking ceremony for a new 12-inch wafer fab in Hefei, China, in which Taiwan's Powerchip Technology is investing, will take place on October 20.

Powerchip in mid-2015 announced the company had reached an agreement with Hefei Construction Investment and Holding to invest in a wafer foundry in Hefei in the Chinese province of Anhui. The foundry will be a 12-inch fab running 0.15-micron, 0.11-micron and 90nm manufacturing processes initially for LCD driver ICs, Powerchip said in a company filing with the Taiwan Stock Exchange (TSE).

Powerchip will be the second Taiwan-based foundry chipmaker, following United Microelectronics (UMC), to construct and operate a 12-inch plant in China.

Powerchip was once Taiwan's largest DRAM chipmaker in terms of production capacity. The company provides 12-inch wafer foundry services for specialty DRAM chips, power management ICs, LCD driver ICs, CMOS image sensors, car-use ICs and others.

By: DocMemory
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