MediaTek and Shanghai Huali Microelectronics (HLMC) have completed the tape-out of a 28nm mobile chip design, according to the China-based 12-inch foundry.

"This 28nm tape-out with MediaTek marks that HLMC has steadily gained great experiences in advanced process technology management and yield improvement, which has paved a solid basis for the further cooperation between HLMC and MediaTek," said Jack Qi Shu, VP of sales & marketing at HLMC, in a statement.

In December 2014, HLMC announced it is working closely with MediaTek on 28nm technology development and wafer manufacturing services.

Previous reports quoted industry sources as saying that HLMC and MediaTek had discussed about expanding their partnership to FinFET chips, but none of the companies confirmed the reports.

Founded in 2010, HLMC is majority owned by the Shanghai government. HLMC in 2011 ramped its 12-inch wafer fab, and directly entered 65/55nm production.

By: DocMemory
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