Friday, December 4, 2015
Operations at United Microelectronics' (UMC) 12-inch wafer fab in Xiamen are expected to kick off as early as third-quarter 2016, according to a report from Japan's Nikkei Asian Review.
UMC held a "topping out" ceremony to celebrate a major milestone of the fab construction in October, the report said.
Citing UMC CEO Po-Wen Yen, the report indicated that the Xiamen fab will be ready to go online in the July-September quarter of 2016, one quarter ahead of the company's original plan.
The 12-inch wafer fab is a 3-way joint venture between UMC, Xiamen Municipal Government and Fujian Electronics and Information Group, according to the Taiwan-based foundry. Construction of the fab began in March 2015. UMC said previously that the fab cleanroom would be ready for equipment move-in by the second quarter of 2016, and the initial production schedule was targeted at late 2016.
By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved
|
