MediaTek's next-generation Helio X30 high-end smartphone solution will be the first chip to be rolled out from Taiwan Semiconductor Manufacturing Company's 10nm production lines, according to a Chinese-language Commercial Times report.

With its 10nm process node and capacity being verified by clients, TSMC is expected to kick off its 10nm production in the fourth quarter of 2016, paving the way for MediaTek to officially launch the Helio X30 chips at the end of the first quarter of 2017, said the paper.

TSMC's 10nm foundry clients for 2017 will also include Apple, HiSilicon Technologies and Qualcomm, the paper added.

The Helio X30, a successor to MediaTek's first deca-core chipset, the X20, will have two Cortex-A73 cores clocked at 2.8 GHz, four Cortex-A53 cores clocked at 2.2 GHz, and four Cortex-A35 cores that will run at 2.0 GHz.

The X30 will also feature a PowerVR 7XTP-MT4 quad-core GPU and support up to 8GB of LPDDR4, fast eMMC5.1 or UFS 2.1 NAND flash storage and dual-cameras up to 26-megapixel, noted the paper.

By: DocMemory
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