Taiwanese foundry United Microelectronics Corp. has initiated mass production of 14nm chips using its 14nm FinFET technology, the company said Thursday (Feb. 23).

UMC (Hsinchu, Taiwan) said it is shipping 14nm wafers to lead customers and has achieved “industry-competitive yields” using the process.

Po-Wen, CEO of UMC, said earlier this month that the company would bring 14nm to production this quarter, ahead of the original schedule. Last April, UMC said 14nm would be in production in the second half of this year.

UMC says its 14nm FinFET technology offers 55 percent higher speeds and twice the gate density compared to its 28nm process technology. The process also consumes about 50 percent less power than 28nm, the company said.

UMC is building the 14nm chips at the company’s Fab 12A in Tainan, Taiwan, and says it expects to steadily ramp the process according to customer demand.

”We will continue to refine this process and are working with other customers to bring the full performance, power and gate density benefits of 14nm FinFET to enable next generation silicon in areas such as networking, AI and various consumer products,” Yen said in a statement.

By: DocMemory
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