Toshiba is sampling shipments embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1.

The products meet AEC-Q100 Grade 2[3]requirements, support the wide temperature range of -40°C to +105°C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications.

The devices  integrate NAND chips fabricated with 15nm process technology and a controller in a single package. Five different capacities of 16GB, 32GB, 64GB, 128GB and 256GB support a variety of automotive applications. These include infotainment, which typically needs high-capacity storage, and wireless communications, which may need only a small capacity.

Storage requirements for automotive applications continue to increase as systems including automotive information and entertainment systems and ADAS become more sophisticated. UFS supports their high performance and density needs. The addition of automotive UFS expands Toshiba Memory Europe’s line-up of embedded NAND flash memory products for automotive applications, which currently includes automotive e-MMC products. Utilising the UFS interface allows the new products to achieve sequential read of 850MB/s and random read of 50kIOPs, which are approximately 2.7 times and 7.1 times faster than their current e-MMC counterparts, respectively.

Other new functions specifically suited to automotive applications have been added to the new UFS products, including Refresh, Thermal Control and Extended Diagnosis. Refresh can be used to refresh data stored in the UFS and can contribute to the extension of the data’s life span. Thermal Control protects against overheating in the high temperatures that can occur in automotive applications. Extended Diagnosis helps users to understand the condition of the product.

By: DocMemory
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