Foxconn Electronics (Hon Hai Precision Industry) has set up a semiconductor subgroup, which is mulling 12-inch fab construction, industry sources have claimed.

Foxconn's semiconductor subgroup is currently led by Young Liu, who also serves as a director of Sharp's board.

Foxconn's chipmaking related affiliates, such as Foxsemicon Integrated Technology, Shunsin Technology and Fitipower Integrated Technology, are already operated under the semiconductor subgroup, the sources said. Foxsemicon produces semiconductor equipment, while Shunsin is an IC backend house specializing in system-in-package (SiP) modules. Fitipower is engaged in the design and development of LCD driver ICs.

Foxconn is also looking to step into wafer fabrication, and already has its semiconductor subgroup evaluate the feasibility of building two 12-inch wafer plants, the sources indicated.

Foxconn previously failed in its bid to acquire Toshiba's memory chip business, but the group has not given up on its semiconductor ambitions, the sources noted.

Foxconn has responded saying it does not comment on market and media rumors.

By: DocMemory
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