Ferroelectric Memory Company (FMC) of Dresden has raised € 4.6 million in a financing round led by eCAPITAL.

The funds will enable the company with base in Dresden to expand its team, accelerate the further development of their solutions and conquer a significant market share by replacing the current standard technology.

MCUs require extended data retention, higher number of write cycles and data retention when exposed to extreme temperatures.

eFlash requires complex manufacturing processes and lags leading edge CMOS by five generations, according to FMC. This hinders MCU miniaturisation. FMC’s memories are made on standard CMOS technology and therefore don’t hinder miniaturisation.

FMC offers its Ferroelectric Field Effect Transistor (FeFET) technology. FeFETs use the ferroelectric properties of hafnium oxide to transform existing standard CMOS transistors into efficient memory cells.

CMOS transistors still enable scaling according to Moore’s Law, and thus derived FeFETs offer superior performance, high density, ultra-low power consumption and extreme temperature stability. The key for becoming the new standard in this industry is that they enable further miniaturization of microcontrollers.

FeFETs can be manufactured on existing production lines without main changes or capital expenditures as hafnium oxide is already a standard isolating material in this industry. In comparison to eFlash, the manufacturing process is much simpler, so that the production costs can be drastically reduced.

"With the support of eCAPITAL, we can hire the right talent, such as Analog / Mixed-Signal Designers and Characterization Engineers, to accelerate our product development and drive market penetration,” says FMC CEO Stefan Müller.

By: DocMemory
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