Semiconductor Manufacturing International (SMIC) expects to move its first-generation FinFET process technology to risk production in the first half of 2019.

SMIC co-CEO Liang Mong Song reiterated the company's push for advanced technology development. SMIC has developed its 28nm HKC+ process platform, and is gearing up for risk production of chips using the company's first-generation FinFET node in the first half of 2019, said Liang at the company's recent investors meeting.

SMIC will continue investing in R&D despite uncertainty around the future economic outlook, Liang noted.

SMIC expressed caution about its performance over the next two quarters. Seasonal factors, as well as macroeconomic factors, will drag down SMIC's capacity utilization rate particularly that at its 12-inch fabs in the fourth quarter, according to co-CEO Zhao Haijun.

SMIC expects to see inventory correction at its clients end and orders pick up in the second quarter of 2019, Zhao indicated.

SMIC's revenue target for 2018 of a high-single digit increase remains unchanged, said Zhao, adding that gross margin is forecast to be at a double-digit percentage.

By: DocMemory
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