Semiconductor Manufacturing International (SMIC) is expected to enter volume production of chips built using 14nm FinFET process technology in the first half of 2019, fulfilling the first orders coming from the handset sector, according to media reports in China.

SMIC has managed to improve its 14nm process manufacturing yield rate to 95%, the reports said. SMIC has made significant progress with its FinFET process development since Liang Mong-song, former R&D guru of Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Foundry, joined the Shanghai-based foundry.

Meanwhile, financial support from the government has been accelerating the development of SMIC's 14nm and more advanced process technologies since 2018, the reports indicated. SMIC has plans to roll out more advanced 10nm and 7nm FinFET processes.

Liang reiterated during SMIC's most-recent investors meeting the foundry's push for advanced technology development. SMIC has developed its 28nm HKC+ process platform, and is gearing up for risk production of chips using the company's first-generation FinFET node in the first half of 2019, according to Liang.

By: DocMemory
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