Wednesday, February 6, 2019
Mobile Semiconductor, the 13 year-old Seattle memory compiler vendor, has come up with a 55nm memory compiler for inexpensive applications like IoT.
The company claims that the 55nm compiler has one of the highest density footprints in the industry reducing the die area by 15-33% compared to previous 55nm compilers.
“We believe that our success in the current 55nm memory compilers sets us apart from competitive offerings,” says Cameron Fisher, founder and CEO of Mobile Semiconductors, “this new high-density product is well positioned to support our customer’s IoT products as they grow in features and capabilities. Our goal is to ensure that our customers can meet and exceed their silicon area goals and therefore reduce their costs.”
“Mobile Semiconductor remains the leader in providing memory compliers that target the needs of specific industries,” adds Fisher “we are proud of the fact that repeat customer purchases are close to 100%. This includes customers moving to the next smaller node or building new products on the same node. Reducing the memory size offered by this new 55nm memory compiler gives our customers a compelling reason to choose Mobile Semiconductor for their cost sensitive IoT products.”
The 55nm HD memory compiler takes advantage of industry standard Bitcells provided by the top foundries. All Mobile Semiconductor memory compilers are supported by a wide range of industry leading licensing options.
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