Wednesday, May 8, 2019
Yangtze Memory Technologies (YMTC) is set to enter volume production of 64-layer 3D NAND flash memory chips by the end of 2019, and has been in talks with parent company Tsinghua Unigroup about obtaining the right to sell and market storage devices employing the chips, according to industry sources.
YMTC originally will have Beijing Unis Memory Technology, also a Tsinghua Unigroup affiliate, sell and promote flash storage solutions such as SSDs and UFS devices powered by YMTC's in-house developed 64-layer 3D NAND chips, the sources indicated.
However, YMTC internally believes the company should own the right to sell and market its own products, namely storage devices incorporating 3D NAND chips based on its in-house developed Xtacking architecture, the sources noted.
YMTC is expected to kick off risk production of 64-layer 3D NAND flash chips as early as the third quarter of 2019, said the sources, adding that the process' production yield rate has seen significant improvement and is satisfactory enough to power consumer electronics products.
YMTC also plays a part in Longsys Electronics' plan to develop what the company claims is "100% China-made" flash storage device. Longsys has already built a close relationship with Tsinghua Unigroup according to the pair's strategic alliance signed in November 2018.
YMTC disclosed previously plans to move 64-layer 3D NAND process technology to volume production in the fourth quarter of 2019, and will move directly to the 128-layer generation with volume production scheduled for 2020.
YMTC was founded in 2016 by China's state-owned Tsinghua Unigroup, which owns 51% of the company. China's National Semiconductor Industry Investment Fund (known as the Big Fund) is among other shareholders of YMTC.
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