Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly grabbed orders for all the 5G modem chips that have been introduced by fabless chipmakers, such as Qualcomm's Snapdragon X50 and HiSilicon's Balong series.

TSMC has kicked off volume production for 5G modem chips for Qualcomm and HiSilicon, and is gearing up for production for MediaTek's Helio M70 5G modem in the second half of 2019, according to industry sources. All their first 5G modem solutions will be built using TSMC's 7nm process technology.

TSMC has also obtained orders for 5G modem from Unisoc, previously know as Unigroup Spreadtrum & RDA, with volume production scheduled for year-end 2019 or early 2020, the sources said. Unisoc planned originally to roll out a high-end 5G smartphone solution utilizing an Intel modem, but has introduced its own 5G modem instead.

Unisoc disclosed previously that its first 5G modem dubbed IVY510 will be manufactured using TSMC's 12nm process technology.

Samsung Electronics announced recently that its 5G communication solutions are in mass production for the latest premium mobile devices. Those include Samsung's first 5G modem solution, the Exynos Modem 5100, which uses Samsung's 10nm LPP process.

By: DocMemory
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