Wednesday, July 10, 2019
Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies, and backend houses such as ChipMOS Technologies, Xintec and ShunSin Technology are ramping up their shipments for 3D sensing solutions for use in smartphones and other mobile devices, as well as automotive ADAS applications.
Win Semi has reportedly cut into the supply chain of Apple by providing Lumentum fabrication services for structured light 3D sensing components. Meanwhile, Win Semi has seen orders for ToF (time-of-flight) 3D sensing solutions ramp up from the non-Apple camp, according to industry sources.
VPEC has entered the supply chain of Samsung Electronics by providing epi-wafers for VCSEL components for use in ToF-based 3D sensors, the sources indicated. VPEC is also a major epi-wafer supplier of Win Semi, the sources continued.
AWSC has enjoyed a pull-in of orders from its major IDM client Ams, which has enhanced its offering to include all three 3D technologies - structured light, ToF and ASV (active stereo vision), the sources noted.
Ams has announced recently it is partnering with SmartSens Technology, a supplier of high-performance CMOS image sensors, to speed market delivery and broaden the diversified 3D product range for mobile, computing, consumer and automotive application areas
In addition, ChipMOS has obtained orders for 3D sensing components from Himax, while ShunSin is engaged in the 3D sensing components supply chain through parent company Foxconn Electronics (Hon Hai Precision Industry), the sources said. Also through its largest shareholder, TSMC, Xintec has obtained orders for 3D sensing solutions, the sources continued.
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