The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend services will find their role more important than that of module assemblers when making 5G devices, according to industry sources.

The currently available under-display fingerprint sensors for smartphones are bonded to CMOS image sensors and assembled in one package - like a super short focus camera. Such a method, nevertheless, is considered "unusual" as module assemblers instead of IC packagers are responsible for most of the backend part including the final testing, the sources noted.

Optical fingerprint sensor suppliers including Goodix and Egis Technology (Egistec) adopt the method also for cost reasons, placing packaging orders for their under-display solutions mainly with module assemblers, the sources indicated. Egistec has reportedly obtained orders from Samsung Electronics, while Goodix is engaged in the supply chain of major China-based smartphone brands.

However, the adoption of WLO (wafer level optics) optical components among smartphones will rise when 5G becomes fully commercialized, the sources said. Chip packages will be required to be even thinner, which can be better achieved through wafer-level packaging.

ASE Technology Holding with its competitive wafer-level backend services is gearing up for the WLO market boom, while Xintec and VisEra Technologies are reportedly among the other players set to ride the wave of the market growth, according to market observers.

Eight-inch foundries will play another increasing role to ensure steady supplies of under-display optical fingerprint sensors for 5G smartphones, the sources also noted. Chip demand for 5G smartphones is set to become robust starting 2020.

By: DocMemory
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